Title:
MOLD SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/188671
Kind Code:
A1
Abstract:
Provided is a mold system comprising: a mold device that includes a fixed mold and a moveable mold, a cavity space formed in the mold device by the fixed mold and the moveable mold, and a gas vent that enables communication between the cavity space and an outside space; a mold device temperature adjusting mechanism for adjusting the temperature of the mold device; and a gas vent heating mechanism for heating the gas vent.
Inventors:
SHISHIDO YOSHIKO (JP)
NAMATAME AKIRA (JP)
KUDOU YUUKI (JP)
NAMATAME AKIRA (JP)
KUDOU YUUKI (JP)
Application Number:
PCT/JP2019/011737
Publication Date:
October 03, 2019
Filing Date:
March 20, 2019
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B29C45/34; B29C33/10
Foreign References:
| JPH08300356A | 1996-11-19 | |||
| JP2007069355A | 2007-03-22 | |||
| JPH0740390A | 1995-02-10 | |||
| JP2018060813A | 2018-04-12 |
Other References:
See also references of EP 3778182A4
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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