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Patent Searching and Data


Title:
MOLDED ARTICLE, ELECTRICAL PRODUCT AND METHOD FOR PRODUCING MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/075125
Kind Code:
A1
Abstract:
[Problem] To provide: a molded article which achieves easier layout of a member for electrical connection of a circuit film to an external connection terminal, said circuit film being integrally molded with a molded body; and an electrical product. [Solution] According to the present invention, a molded body 30 has one main surface 31, with which a circuit film 20 is integrally molded, and the other main surface 32 that is on the reverse side of the one main surface 31. A flexible printed wiring board 40 comprises: an internal connection terminal 41 that is electrically connected to an electrical circuit of the circuit film 20; an external connection terminal 42 that is exposed to the outside from the other main surface 32 of the molded body 30; and a flexible wiring line 43 that is connected to the internal connection terminal 41 and the external connection terminal 42, while extending and penetrating through the molded body 30 so as to reach the other main surface 32.

Inventors:
YAMAZAKI, Seiichi (LTD. 3 Mibu Hanai-cho, Nakagyo-ku, Kyoto-sh, Kyoto 51, JP)
HIGASHIKAWA, Toshihiro (LTD. 3 Mibu Hanai-cho, Nakagyo-ku, Kyoto-sh, Kyoto 51, JP)
HIRAI, Hitoshi (LTD. 3 Mibu Hanai-cho, Nakagyo-ku, Kyoto-sh, Kyoto 51, JP)
Application Number:
JP2020/029124
Publication Date:
April 22, 2021
Filing Date:
July 29, 2020
Export Citation:
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Assignee:
NISSHA CO.,LTD. (Nakagyo-ku Kyoto-sh, Kyoto 51, JP)
International Classes:
B29C45/14; B29C33/12; H01R43/24; H05K1/02; H05K3/00; H05K3/28; H05K5/00; H01R13/405
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