Title:
MOLDED ARTICLE AND SUBSTRATE FORMED FROM SAID MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/070767
Kind Code:
A1
Abstract:
This invention provides a molded article that is suitable for the formation of a substrate having excellent flexibility. This molded article is formed from a resin composition including a fluorine-containing polyimide resin (A) and a resin (B) that is different from resin (A), wherein the dielectric loss tangent of resin (A) and the dielectric loss tangent of resin (B) satisfy formula (1). (1): Dielectric loss tangent of resin (A) > dielectric loss tangent of resin (B)
Inventors:
DAIMATSU KAZUKI (JP)
KARASAWA MASAYOSHI (JP)
KARASAWA MASAYOSHI (JP)
Application Number:
PCT/JP2020/037688
Publication Date:
April 15, 2021
Filing Date:
October 05, 2020
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08G73/10; C08L27/08; C08L67/00; C08L79/08; H05K1/03
Foreign References:
| JP2015519226A | 2015-07-09 | |||
| US20190169434A1 | 2019-06-06 | |||
| JPH11255992A | 1999-09-21 | |||
| JPH06179816A | 1994-06-28 |
Other References:
OKUYA, EITARO: "1, 2- Polybutadiene thermoplastic elastomers", PERMITTIVITY(E, vol. 57, no. 11, 1984, Nippon Gomu Kyokaishi
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
Download PDF: