Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2012/098865
Kind Code:
A1
Abstract:
This molded body is formed from a composition which contains: 100 parts by weight of at least one resin that is selected from the group consisting of thermoplastic resins and thermosetting resins; and 0.01-10,000 parts by weight of a silylated polyolefin that is obtained by a reaction between a silicon-containing compound that contains a structural unit represented by formula (1) and a vinyl group-containing compound that has a number average molecular weight as determined by a GPC method of 100-500,000 (inclusive) (excluding the cases where a compound having two or more SiH groups per molecule is used as the silicon-containing compound and a compound having an average of 2.0 or more vinyl groups per molecule is used as the vinyl group-containing compound), a derivative of the silylated polyolefin or a mixture of the silylated polyolefin and a derivative thereof. -Si(R1)H-Y1- (1) (In formula (1), R1 represents a hydrogen atom, a halogen atom or a hydrocarbon group, and Y1 represents O, S or NR30 (wherein R30 represents a hydrogen atom or a hydrocarbon group).)

Inventors:
MATOISHI KAORI (JP)
YANO TAKUMA (JP)
MARUBAYASHI HIROMASA (JP)
TOMOSHIGE NAOKI (JP)
NAGAI NAOSHI (JP)
HARADA TAMOTSU (JP)
KAWABE KUNIAKI (JP)
Application Number:
PCT/JP2012/000260
Publication Date:
July 26, 2012
Filing Date:
January 18, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUI CHEMICALS INC (JP)
MATOISHI KAORI (JP)
YANO TAKUMA (JP)
MARUBAYASHI HIROMASA (JP)
TOMOSHIGE NAOKI (JP)
NAGAI NAOSHI (JP)
HARADA TAMOTSU (JP)
KAWABE KUNIAKI (JP)
International Classes:
C08L101/00; C08F8/42; C08F10/02; C08F210/00; C08G77/442; C08G81/02; C08L23/26
Domestic Patent References:
WO2008004514A12008-01-10
WO2007114102A12007-10-11
WO2007105483A12007-09-20
WO2007114009A12007-10-11
WO2007122906A12007-11-01
Foreign References:
JP2010037555A2010-02-18
JP2008133320A2008-06-12
JP2011026448A2011-02-10
JP2002522604A2002-07-23
JP2003073412A2003-03-12
JP2004196883A2004-07-15
JP2004149552A2004-05-27
JP2004035813A2004-02-05
JP2000239312A2000-09-05
JP2001002731A2001-01-09
JP2004262993A2004-09-24
JP2000191862A2000-07-11
JP2002097325A2002-04-02
JPH0457844A1992-02-25
Other References:
See also references of EP 2666828A4
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
Download PDF:
Claims: