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Title:
MOLDED RESIN-EQUIPPED ELECTRIC WIRE AND MOLDED RESIN-EQUIPPED ELECTRIC WIRE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2017/010308
Kind Code:
A1
Abstract:
The purpose of the present invention is to reduce the leakage of a resin in the interior of an insert-molding mold to the exterior of the mold when forming a molded resin on a terminal-equipped conducting wire. The invention comprises a step of forming, in a conducting wire 12 of a terminal-equipped conducting wire 10, a smooth portion 16 whereof the outer peripheral surface 161 is smooth at a position on the other side from a terminal connection portion 141 and separated therefrom (smooth portion forming step S2). In addition, the invention further comprises a step of forming a molded resin 20 covering the terminal connection portion 141 in a state in which the terminal connection portion 141 of the terminal-equipped conducting wire 10 in which the smooth portion 16 has been formed is inserted into the insert-molding mold 5, and the conducting wire 12 extending from a metal terminal is exposed from an opening portion 55 of the mold 5 to the exterior (insert-molding step S3). The external shape of the smooth portion 16 is a shape corresponding to the shape of the opening in the opening portion 55 of the mold 5. In the insert-molding step S3, the resin is filled into the mold 5 in a state in which the internal peripheral surface of the opening portion 55 of the mold 5 is in contact with the outer peripheral surface 161 of the smooth portion 16.

Inventors:
HASHIMOTO DAISUKE (JP)
FUKUMOTO KOUJI (JP)
HIROOKA TOSHIYA (JP)
KIM JISUNG (JP)
MIYAMOTO KENJI (JP)
HIROSE MITSURU (JP)
HORIO HITOSHI (JP)
Application Number:
PCT/JP2016/069577
Publication Date:
January 19, 2017
Filing Date:
July 01, 2016
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R4/70; B29C33/12; H01R43/24
Foreign References:
JP2013025998A2013-02-04
JP2001162647A2001-06-19
JP2014170618A2014-09-18
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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