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Title:
MOLDING APPARATUS, MOLDING METHOD, AND METHOD FOR MANUFACTURING ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/213571
Kind Code:
A1
Abstract:
This molding apparatus for molding a composition on a substrate by using a mold is provided with: a supplying unit for supplying the composition onto the substrate; a plurality of processing units including a first processing unit and a second processing unit and bringing the composition, which is supplied onto the substrate by the supplying unit, into contact with the mold; a substrate transfer unit for transferring, to the first processing unit, the substrate onto which the composition is supplied by the supplying unit, and transferring, to the second processing unit, another substrate onto which the composition is supplied next to the substrate.

Inventors:
IWATANI SATOSHI (JP)
CHOI BYUNG-JIN (JP)
MIZUNO MAKOTO (JP)
Application Number:
PCT/JP2020/016325
Publication Date:
October 22, 2020
Filing Date:
April 13, 2020
Export Citation:
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Assignee:
CANON KK (JP)
International Classes:
H01L21/677; B29C59/02
Foreign References:
JP2012164809A2012-08-30
JP2017022243A2017-01-26
JP2019051507A2019-04-04
JP2015012280A2015-01-19
JP2018006560A2018-01-11
JP2017120928A2017-07-06
Attorney, Agent or Firm:
OHTSUKA, Yasunori et al. (JP)
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