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Patent Searching and Data


Title:
MOLDING APPARATUS AND METHOD FOR MOLDING USING SAME
Document Type and Number:
WIPO Patent Application WO/2020/075681
Kind Code:
A1
Abstract:
Provided are: a molding apparatus whereby gas that occurs in a cavity can be smoothly and adequately discharged to the outside through a discharge hole, and molten metal can be restrained from reaching the discharge hole; and a method for molding using the molding apparatus. A molding apparatus for obtaining an annular molded article, the molding apparatus comprising: a fixed die D1 and a movable die D2 whereby an annular cavity C can be formed; a first block B1 and a second block B2 which are formed on the inside of the cavity C in the fixed die D1 and the movable die D2 and are configured so as to be able to form a flow channel R communicated with the cavity C, and in which molten metal and gas that occurs in the cavity C can flow through the flow channel R; and a discharge hole B2b which is formed in the second block B2 and which can discharge, to the outside, gas that flows through the flow channel R; wherein the surfaces of the first block B1 and the second block B2 that form the flow channel R are configured so as to have an outer circumferential shape following the inner circumferential shape of the cavity C.

Inventors:
KURITA YUKINORI (JP)
KAMBARA MAKOTO (JP)
Application Number:
PCT/JP2019/039516
Publication Date:
April 16, 2020
Filing Date:
October 07, 2019
Export Citation:
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Assignee:
FCC KK (JP)
International Classes:
B22D17/22; B22C9/06; B29C33/10
Foreign References:
JPH08290232A1996-11-05
JP2007038454A2007-02-15
JPH0565459U1993-08-31
JPS63816U1988-01-06
JP2004298910A2004-10-28
JP2008080391A2008-04-10
Attorney, Agent or Firm:
KOSHIKAWA Takao (JP)
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