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Patent Searching and Data


Title:
MOLDING APPARATUS AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/195579
Kind Code:
A1
Abstract:
Provided is a molding apparatus (molding apparatus 10) for molding a metal pipe (metal pipe 100) by expanding a metal pipe material (metal pipe material 14), the molding apparatus comprising: electrodes (electrodes 17, 18) for holding the metal pipe material and supplying electric power to the metal pipe material to heat the metal pipe material; a molding die (molding die 30) for quenching the expanded metal pipe; and members (first insulating materials 91a, 101a, sliding materials 92, 102) disposed between the electrodes and the molding die, wherein the unquenched region of the metal pipe is adjusted through the length adjustment of the members.

Inventors:
ISHIZUKA MASAYUKI (JP)
NOGIWA KIMIHIRO (JP)
IDE AKIHIRO (JP)
UENO NORIEDA (JP)
Application Number:
PCT/JP2020/008691
Publication Date:
October 01, 2020
Filing Date:
March 02, 2020
Export Citation:
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Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B21D37/16; B21D26/033; B21D51/10
Foreign References:
JP2015221445A2015-12-10
US6613164B22003-09-02
US20070101786A12007-05-10
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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