Title:
MOLDING DEVICE AND METHOD FOR MANUFACTURING ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/054392
Kind Code:
A1
Abstract:
Provided is a molding device for molding a composition on a substrate using a mold, the molding device characterized by comprising a control unit for controlling a process of contacting a first surface of the mold and the composition to each other to form a film of the composition between the first surface and the substrate, and a deforming unit for applying a force to a second surface of the mold opposite the first surface to deform the first surface into a protruding shape on the substrate side, wherein the control unit controls the deforming unit so that, during the process, the force that the deforming unit applies to the second surface after the first surface and the composition are contacted with each other is greater than the force that the deforming unit applies to the second surface before the first surface and the composition are contacted with each other.
Inventors:
SHIODE YOSHIHIRO (JP)
Application Number:
PCT/JP2021/026191
Publication Date:
March 17, 2022
Filing Date:
July 12, 2021
Export Citation:
Assignee:
CANON KK (JP)
International Classes:
H01L21/027; B29C59/02
Foreign References:
| JP2014069339A | 2014-04-21 | |||
| JP2020009899A | 2020-01-16 | |||
| JP2010221374A | 2010-10-07 | |||
| JP2019186404A | 2019-10-24 | |||
| JP2018163964A | 2018-10-18 | |||
| KR20090020922A | 2009-02-27 |
Attorney, Agent or Firm:
OHTSUKA PATENT OFFICE, P.C. (JP)
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