Title:
MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/038083
Kind Code:
A1
Abstract:
This molding device heats a metal material and performs quenching, wherein a plurality of components are molded by performing molding once on one metal material.
Inventors:
ISHIZUKA MASAYUKI (JP)
SAKAMAKI KOZABURO (JP)
KUMENO HIROYUKI (JP)
UENO NORIEDA (JP)
SAKAMAKI KOZABURO (JP)
KUMENO HIROYUKI (JP)
UENO NORIEDA (JP)
Application Number:
PCT/JP2022/033727
Publication Date:
March 16, 2023
Filing Date:
September 08, 2022
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B21D26/033; B21D22/20; B21D24/00
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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