Title:
MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/042488
Kind Code:
A1
Abstract:
This molding device uses at least a part of a member of an existing press device and supplies a fluid to carry out expansion molding of a metal material.
Inventors:
YAMAUCHI KEI (JP)
KOUYAMA EIJI (JP)
KAN HIROYUKI (JP)
UENO NORIEDA (JP)
KOUYAMA EIJI (JP)
KAN HIROYUKI (JP)
UENO NORIEDA (JP)
Application Number:
PCT/JP2022/021249
Publication Date:
March 23, 2023
Filing Date:
May 24, 2022
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B21D26/039
Foreign References:
JP2020151754A | 2020-09-24 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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