MOLDING DIE, MOLDING METHOD, DISK SUBSTRATE, AND MOLDING MACHINE

Title:

MOLDING DIE, MOLDING METHOD, DISK SUBSTRATE, AND MOLDING MACHINE

Document Type and Number:

WIPO Patent Application WO/2004/045822

Kind Code:

A1

Abstract:

A molding die, a molding method, a disk substrate, and a molding machine where burrs are prevented from forming on the substrate so that its quality is improved. The molding die has a mirror surfacing machine (16), a stamper (29) having a hole at its center and installed on the front end face of the mirror finishing machine (16), and an inner holder (60) holding the stamper (29) by being pressed in the hole. At least either of the stamper (29) and the inner holder (60) is plastically deformed by stress exceeding a yielding point caused by the press-in. Because the stamper (29) is held by pressing the inner holder (60) in the hole of the stamper (29), a press allowance is not required to be formed at the front end of the inner holder (60). Because no recess groove is formed in the disk substrate, the printing area on the disk substrate can be enlarged.

Inventors:

INADA YUICHI (JP)
SAKAMOTO YASUYOSHI (JP)

Application Number:

PCT/JP2003/014572

Publication Date:

June 03, 2004

Filing Date:

November 17, 2003

Export Citation:

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Assignee:

SUMITOMO HEAVY INDUSTRIES (JP)
SEIKO GIKEN KK (JP)
INADA YUICHI (JP)
SAKAMOTO YASUYOSHI (JP)

International Classes:

B29C45/26; B29C45/38; (IPC1-7): B29C33/30

Foreign References:

JPH10128807A	1998-05-19
JP2002100078A	2002-04-05

Other References: