Title:
MOLDING DIE AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/018450
Kind Code:
A1
Abstract:
In order to mold a connector equipped, on an outer peripheral surface thereof, with an annular groove and a rib (5), a molding die (100) has: a first die block (10) for molding one-half of the region of the outer peripheral surface and the annular groove; a second die block (20) for molding a region on one side of a region other than the region formed by the first die block (10); and a third die block (30) for molding a region on the other side of the region other than the region formed by the fist die block (10). A dividing surface (28) of the second die block (20) and a dividing surface (39) of the third die block (30) which abut each other are each formed at the abutting position in a normal direction to a concave surface (22) of the second die block (20) and a concave surface (32) of the third die block (30) for molding an outer peripheral surface (2a).
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| JPS59187429 | [Title of the device] Molding die |
| JP5562083 | Mold for molding |
Inventors:
SATO AKIRA (JP)
TAKAHASHI KENJI (JP)
KATO TERUO (JP)
HINODA YUSUKE (JP)
TAKAHASHI KENJI (JP)
KATO TERUO (JP)
HINODA YUSUKE (JP)
Application Number:
PCT/JP2016/072019
Publication Date:
February 02, 2017
Filing Date:
July 27, 2016
Export Citation:
Assignee:
YAZAKI CORP (JP)
International Classes:
B29C33/44; H01R43/18
Foreign References:
| JPH1119976A | 1999-01-26 | |||
| JPS56109723A | 1981-08-31 | |||
| JPH07236960A | 1995-09-12 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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