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Patent Searching and Data


Title:
MOLDING DIE AND RESIN MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/010319
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a molding die whereby misalignment or dropout of a workpiece retained on a die clamp surface is prevented, and large size in a resin package part can be ensured. As a means for solving this problem, a workpiece retaining part (6d) for pressing against an external peripheral surface of a workpiece (W) and retaining the workpiece (W) is provided on an upper die clamp surface (6a) in a molding die (6), the workpiece retaining part (6d) being disposed facing the workpiece (W) at a plurality of locations along the outer shape of the workpiece (W).

Inventors:
NAKAZAWA HIDEAKI (JP)
NAKAJIMA KENJI (JP)
OKAMOTO MASASHI (JP)
Application Number:
PCT/JP2016/069652
Publication Date:
January 19, 2017
Filing Date:
July 01, 2016
Export Citation:
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Assignee:
APIC YAMADA CORP (JP)
International Classes:
B29C43/18; B29C33/12; B29C43/32; B29C43/36; H01L21/56; B29L9/00
Foreign References:
JP2012187902A2012-10-04
JP2007301939A2007-11-22
JP2006156905A2006-06-15
JP2012126074A2012-07-05
JP2015107657A2015-06-11
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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