Title:
MOLDING DIE AND RESIN MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/010319
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a molding die whereby misalignment or dropout of a workpiece retained on a die clamp surface is prevented, and large size in a resin package part can be ensured. As a means for solving this problem, a workpiece retaining part (6d) for pressing against an external peripheral surface of a workpiece (W) and retaining the workpiece (W) is provided on an upper die clamp surface (6a) in a molding die (6), the workpiece retaining part (6d) being disposed facing the workpiece (W) at a plurality of locations along the outer shape of the workpiece (W).
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Inventors:
NAKAZAWA HIDEAKI (JP)
NAKAJIMA KENJI (JP)
OKAMOTO MASASHI (JP)
NAKAJIMA KENJI (JP)
OKAMOTO MASASHI (JP)
Application Number:
PCT/JP2016/069652
Publication Date:
January 19, 2017
Filing Date:
July 01, 2016
Export Citation:
Assignee:
APIC YAMADA CORP (JP)
International Classes:
B29C43/18; B29C33/12; B29C43/32; B29C43/36; H01L21/56; B29L9/00
Foreign References:
JP2012187902A | 2012-10-04 | |||
JP2007301939A | 2007-11-22 | |||
JP2006156905A | 2006-06-15 | |||
JP2012126074A | 2012-07-05 | |||
JP2015107657A | 2015-06-11 |
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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