Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDING DIE AND SEALING MEMBER
Document Type and Number:
WIPO Patent Application WO/2021/145047
Kind Code:
A1
Abstract:
A molding die 10 for molding an endless-shaped gasket made of an elastic material on a surface 2a of a plate-like base material 2 is provided with: a cavity portion 4 formed on an opposite face 12a opposite to the surface 2a of the base material 2 and corresponding to the shape of the gasket; a gate 5 for introducing a molding material that hardens into the elastic material; a first intermediate portion 41 that connects an opening of the gate 5 with the cavity portion 4, and of which a cross section along the surface 2a of the base material 2 has a cross-sectional area greater than an opening area of the opening of the gate 5; a vent 6 for discharging unwanted gas that is not necessary for molding; and a second intermediate portion 42 that connects an opening of the vent 6 on the cavity portion 4 side extending along the surface 2a of the base material 2 with the cavity portion 4, and of which a cross section along the surface 2a of the base material 2 has a cross-sectional area greater than the opening area of the opening of the gate 5.

Inventors:
MURASAKI SHUN (JP)
YOSHIDA BUNPEI (JP)
Application Number:
PCT/JP2020/040250
Publication Date:
July 22, 2021
Filing Date:
October 27, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NOK CORP (JP)
International Classes:
B29C45/14; B29C33/42; B29C45/34; B29C45/37; H01M8/0286
Domestic Patent References:
WO2010113558A12010-10-07
Foreign References:
JP2010003508A2010-01-07
JPS6087044A1985-05-16
JP2000185116A2000-07-04
JP2011098480A2011-05-19
Attorney, Agent or Firm:
WATANABE Kazuhira (JP)
Download PDF: