Title:
MOLDING METHOD AND MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/160091
Kind Code:
A1
Abstract:
This molding method involves: a first step in which a perforation pin (2) is made to protrude into a void (13) in a mold (1); a second step in which a molten resin (16) is injected to fill the void (13) so as to envelop the protruding part of the perforation pin (2); a third step in which, in a state in which the resin (16) is in an uncured state, the perforation pin (2) is made to protrude further; and a fourth step in which the resin (16) is cured to obtain a resin molded product.
Inventors:
IKEDA KOSUKE (JP)
WATANABE YASUNORI (JP)
SAKON KANA (JP)
OKABE RYOJI (JP)
OKUDA AKIHISA (JP)
OZAKI RYOTA (JP)
WATANABE YASUNORI (JP)
SAKON KANA (JP)
OKABE RYOJI (JP)
OKUDA AKIHISA (JP)
OZAKI RYOTA (JP)
Application Number:
PCT/JP2019/005603
Publication Date:
August 22, 2019
Filing Date:
February 15, 2019
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B29C45/26; B29C33/44
Foreign References:
| JPS5351262A | 1978-05-10 | |||
| JP2007098714A | 2007-04-19 | |||
| JPH09141698A | 1997-06-03 | |||
| JP2007331119A | 2007-12-27 | |||
| JPH07100879A | 1995-04-18 | |||
| JPS60166416A | 1985-08-29 | |||
| JP2018026484A | 2018-02-15 | |||
| JP2717896B2 | 1998-02-25 |
Other References:
See also references of EP 3718733A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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