Title:
MOLDING MOLD, MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/154775
Kind Code:
A1
Abstract:
This molding mold is characterized by the following: being provided with a first die having a through hole, a second die that is inserted in the through hole and is capable of relative movement with respect to the first die, and a first punch and a second punch that can each be inserted in the through hole; an undercut forming part being provided to the second die; and an object to be molded being compression-molded in a cavity surrounded by an inner side surface of the through hole, the second die, the first punch, and the second punch.
Inventors:
MARUYAMA TSUNEO (JP)
TAMURA YOSHIKI (JP)
SAKAI HIDEO (JP)
TAMURA YOSHIKI (JP)
SAKAI HIDEO (JP)
Application Number:
PCT/JP2017/008504
Publication Date:
September 14, 2017
Filing Date:
March 03, 2017
Export Citation:
Assignee:
DIAMET CORP (JP)
International Classes:
B30B11/02; B22F3/02; B22F3/03
Foreign References:
| JPS528551B1 | ||||
| JPS5943106U | 1984-03-21 | |||
| JP2003193113A | 2003-07-09 | |||
| JP2004298917A | 2004-10-28 | |||
| JPS51149106A | 1976-12-21 |
Other References:
See also references of EP 3427938A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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