Title:
MOLDING MOLD AND PRODUCTION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/015092
Kind Code:
A1
Abstract:
A molding mold according to the present disclosure includes a cylindrical part and a base part which seals one end of the cylindrical part. A cut level difference Rδc1 in a roughness curve of the inner wall surface of the cylindrical part is smaller than a cut level difference Rδc2 in a roughness curve of the inner wall bottom section of the base part. The cut level difference is a difference between the cut level at a load length rate of 25% in the roughness curve and the cut level at a load length rate of 75% in the roughness curve.
Inventors:
HAMASHIMA HIROSHI (JP)
Application Number:
PCT/JP2020/027673
Publication Date:
January 28, 2021
Filing Date:
July 16, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
B22F3/02; B22F5/00; B30B11/00; C04B35/111
Domestic Patent References:
| WO2018198983A1 | 2018-11-01 |
Foreign References:
| JP2008272774A | 2008-11-13 | |||
| JPH1142618A | 1999-02-16 | |||
| JP2018019017A | 2018-02-01 |
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (JP)
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