Title:
MOLDING MOLD
Document Type and Number:
WIPO Patent Application WO/2022/050074
Kind Code:
A1
Abstract:
This molding mold is for molding a heated metal material, wherein the molding mold includes: a first region which has a molding surface that comes into contact with the metal material when molding is performed, the molding surface being for cooling the metal material; and a second region which is formed on a section of the molding surface, and which is constituted by a low thermal-conductivity material having a lower thermal conductivity as compared to the first region.
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Inventors:
YAMAUCHI KEI (JP)
Application Number:
PCT/JP2021/030453
Publication Date:
March 10, 2022
Filing Date:
August 19, 2021
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B21D26/047; B21D24/00; B21D37/02
Foreign References:
| JP2014533608A | 2014-12-15 | |||
| US5916389A | 1999-06-29 | |||
| JP2012000654A | 2012-01-05 | |||
| JP2009220141A | 2009-10-01 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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