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Title:
MOLDING POWDER
Document Type and Number:
WIPO Patent Application WO/2019/208760
Kind Code:
A1
Abstract:
The present invention provides a molding powder for powder bed fusion that includes a fluorine resin powder, wherein the D50 of the fluorine resin is 30-200 μm and the D10 of the fluorine resin is 12 μm or greater.

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Inventors:
KOMORI HIROKAZU (JP)
TERADA JUNPEI (JP)
SENDAN HIROYUKI (JP)
YABU TADAHIRO (JP)
FUKAGAWA YUKIHIRO (JP)
MURAYAMA KENTA (JP)
SHIROMARU TOMOHIRO (JP)
MIYATANI TOSHIO (JP)
KONDOU MASAHIRO (JP)
HAMADA HIROYUKI (JP)
Application Number:
PCT/JP2019/017887
Publication Date:
October 31, 2019
Filing Date:
April 26, 2019
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
International Classes:
B29C64/314; B29C64/135; C08K3/013; C08K3/36; C08L27/18
Domestic Patent References:
WO2018066433A12018-04-12
WO2007049591A12007-05-03
WO2017057333A12017-04-06
WO2017127572A12017-07-27
WO2017173258A12017-10-05
WO2007133912A22007-11-22
Foreign References:
US20170174932A12017-06-22
JP2017007221A2017-01-12
JP2010180099A2010-08-19
Other References:
See also references of EP 3785883A4
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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