Title:
MOLDING RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/065946
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a molding resin composition that supports an excellent continuous productivity and can produce a molded article that has a high surface smoothness, is resistant to molding defects, is resistant to the occurrence of cracking during use, and exhibits an excellent impact resistance; and a molded article that contains the molding resin composition. The present invention pertains to a molding resin composition comprising a chlorinated vinyl chloride-based resin and a melting additive. As obtained by measurement by the solid echo method at 100°C using pulse NMR and waveform separation of the free induction decay curve for 1H spin-spin relaxation into three curves originating with a component A100, a component B100, and a component C100 in order of shorter relaxation time by the least squares method, the molding resin composition has a component ratio for the component C100 [component C100/(component A100 + component B100 + component C100)] of not more than 30%.
Inventors:
MATSUMOTO MITSUO (JP)
YAMASUGI RYOTA (JP)
HORINOUCHI TOMOHIRO (JP)
ARAI YOSHITO (JP)
KUSAKA YASUNARI (JP)
NAKAJIMA NAMI (JP)
YAMASUGI RYOTA (JP)
HORINOUCHI TOMOHIRO (JP)
ARAI YOSHITO (JP)
KUSAKA YASUNARI (JP)
NAKAJIMA NAMI (JP)
Application Number:
PCT/JP2020/037002
Publication Date:
April 08, 2021
Filing Date:
September 29, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08F8/20; C08F8/06; C08L23/30; C08L27/24
Domestic Patent References:
WO2019065742A1 | 2019-04-04 | |||
WO2016013638A1 | 2016-01-28 | |||
WO2015046456A1 | 2015-04-02 |
Foreign References:
JP2000186113A | 2000-07-04 | |||
JP2003112357A | 2003-04-15 | |||
JPH10245492A | 1998-09-14 | |||
JPH1060159A | 1998-03-03 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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