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Patent Searching and Data


Title:
MOLDING RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/065946
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a molding resin composition that supports an excellent continuous productivity and can produce a molded article that has a high surface smoothness, is resistant to molding defects, is resistant to the occurrence of cracking during use, and exhibits an excellent impact resistance; and a molded article that contains the molding resin composition. The present invention pertains to a molding resin composition comprising a chlorinated vinyl chloride-based resin and a melting additive. As obtained by measurement by the solid echo method at 100°C using pulse NMR and waveform separation of the free induction decay curve for 1H spin-spin relaxation into three curves originating with a component A100, a component B100, and a component C100 in order of shorter relaxation time by the least squares method, the molding resin composition has a component ratio for the component C100 [component C100/(component A100 + component B100 + component C100)] of not more than 30%.

Inventors:
MATSUMOTO MITSUO (JP)
YAMASUGI RYOTA (JP)
HORINOUCHI TOMOHIRO (JP)
ARAI YOSHITO (JP)
KUSAKA YASUNARI (JP)
NAKAJIMA NAMI (JP)
Application Number:
PCT/JP2020/037002
Publication Date:
April 08, 2021
Filing Date:
September 29, 2020
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08F8/20; C08F8/06; C08L23/30; C08L27/24
Domestic Patent References:
WO2019065742A12019-04-04
WO2016013638A12016-01-28
WO2015046456A12015-04-02
Foreign References:
JP2000186113A2000-07-04
JP2003112357A2003-04-15
JPH10245492A1998-09-14
JPH1060159A1998-03-03
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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