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Patent Searching and Data


Title:
MOLDING SYSTEM, IRREGULARITY PREDICTION DEVICE, IRREGULARITY PREDICTION METHOD, PROGRAM, AND TRAINED MODEL
Document Type and Number:
WIPO Patent Application WO/2021/206017
Kind Code:
A1
Abstract:
A molding system (10) comprises a molding device (20) and an irregularity prediction device (40). The irregularity prediction device (40) is configured to acquire an evaluation value pertaining to a change of pressure of a molding material after a holding–pressure–releasing operation of the molding device (20) on the basis of time series data of the pressure of the molding material in a cavity of a die of the molding device (20), and, on the basis of the evaluation value, to acquire prediction information for predicting the burr condition of a molded product.

Inventors:
ADACHI TOMOYA (JP)
BABA TOSHIYUKI (JP)
TSUJI SHINTAROU (JP)
OKUBO YUSUKE (JP)
KIMURA KOUJI (JP)
Application Number:
PCT/JP2021/014318
Publication Date:
October 14, 2021
Filing Date:
April 02, 2021
Export Citation:
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Assignee:
JTEKT CORP (JP)
International Classes:
B29C45/17; B29C45/76
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
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