Title:
MOLDING SYSTEM AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/182358
Kind Code:
A1
Abstract:
This molding system is provided with: a molding device comprising a fluid supplying unit that supplies a fluid to a metal pipe material that has been heated, and a molding mold that forms a molded body as a result of the expanded metal pipe material being brought into contact with a molding surface; a processing unit that processes the molded body which was removed from the molding mold; and a scale removing unit that removes scale from the molded body which was processed by the processing unit.
Inventors:
SAIKA MASAYUKI (JP)
Application Number:
PCT/JP2021/008833
Publication Date:
September 16, 2021
Filing Date:
March 05, 2021
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B23P23/04; B21D26/035; B24C1/00; B24C11/00
Foreign References:
| JP2013046916A | 2013-03-07 | |||
| JP2016022482A | 2016-02-08 | |||
| JP2017536474A | 2017-12-07 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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