Title:
MOLDING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/186055
Kind Code:
A1
Abstract:
This molding system comprises: a heating unit that heats a plated metal material by applying electrical current to the metal material; a molding die for molding the heated metal material; and a plating deviation suppression mechanism for suppressing plating deviation in the metal material due to electric heating.
Inventors:
NOGIWA KIMIHIRO (JP)
IDE AKIHIRO (JP)
KAWAKAMI MASASHI (JP)
IDE AKIHIRO (JP)
KAWAKAMI MASASHI (JP)
Application Number:
PCT/JP2022/007696
Publication Date:
September 09, 2022
Filing Date:
February 24, 2022
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B21D26/021; B21C37/16; B21D26/033
Foreign References:
| JP2010070800A | 2010-04-02 | |||
| JP2012115864A | 2012-06-21 | |||
| JPH0871771A | 1996-03-19 | |||
| JP2012166242A | 2012-09-06 | |||
| JP2009220141A | 2009-10-01 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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