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Patent Searching and Data


Title:
MOTION SENSOR MODULE AND MOVABLE PLATFORM
Document Type and Number:
WIPO Patent Application WO/2021/134584
Kind Code:
A1
Abstract:
Disclosed are a motion sensor module and a movable platform. The motion sensor module comprises: a motion sensor (10); a bearing frame (20), used for bearing the motion sensor (10); a mounting frame (30), used for connecting an external mechanism, wherein the mounting frame (30) and the bearing frame (20) are arranged in an opposite and spaced manner; and a plurality of damping mechanisms (40) arranged around the bearing frame (20) in a distributed manner, wherein one end of each damping mechanism (40) is connected to the mounting frame (30), and the other end of each damping mechanism (40) is connected to the bearing frame (20), the axial rigidity of each damping mechanism (40) is greater than the radial rigidity thereof, and each damping mechanism (40) axially extends in such a way that same is tilted from the bearing frame (20) outwards.

Inventors:
JIANG LI (CN)
CHEN KAI (CN)
SUN XIAOXUAN (CN)
Application Number:
PCT/CN2019/130746
Publication Date:
July 08, 2021
Filing Date:
December 31, 2019
Export Citation:
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Assignee:
SZ DJI TECHNOLOGY CO LTD (CN)
International Classes:
B64D43/00; B64D47/00; F16F15/04
Foreign References:
CN110143288A2019-08-20
CN207595275U2018-07-10
CN209414509U2019-09-20
US20100037694A12010-02-18
Attorney, Agent or Firm:
TEKYRS INTELLECTUAL PROPERTY INC. (CN)
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