Title:
MOUNTING BOARD MANUFACTURING METHOD AND FLUX COATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/054384
Kind Code:
A1
Abstract:
A mounting board manufacturing method to solder a terminal of an electronic component to a land 2 of a board 1 is provided with: a paste disposing step for disposing solder paste on the land 2; a melting and hardening step for melting and hardening the solder paste to form a solder pre-coating portion 3 on the land 2; a breaking step for pressing tools 432 and 442 against the pre-coating portion 3, thereby breaking residues which covers a surface of the pre-coating portion 3; a flux disposing step for disposing a flux F on the pre-coating portion 3; a component mounting step for mounting the electronic component on the board 1 with a terminal of the electronic component positioned with the pre-coating portion 3; and a reflow step for heating the board 1 and melting the pre-coating portion 3 to solder the terminal to the land 2. As a result, it is possible to provide the mounting board manufacturing method capable of reducing an occurrence of a soldering failure.
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Inventors:
MANTANI MASAYUKI
SAKAI TADAHIKO
MAEDA TADASHI
YOSHIOKA YUKI
SAKAI TADAHIKO
MAEDA TADASHI
YOSHIOKA YUKI
Application Number:
PCT/JP2021/025337
Publication Date:
March 17, 2022
Filing Date:
July 05, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B23K3/00; B41F15/08; B41F15/40; H05K3/34
Foreign References:
| JP2005116917A | 2005-04-28 | |||
| JPH09321425A | 1997-12-12 | |||
| JPH08250846A | 1996-09-27 |
Attorney, Agent or Firm:
KAWASAKI, HASHIMOTO AND PARTNERS (JP)
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