Title:
MULTI-CHIP MODULE LIFE EVALUATION MODULE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2022/061863
Kind Code:
A1
Abstract:
An evaluation module (200) for evaluating the life of a multi-chip module (100), which comprises a first substrate (110) and multiple chips to be evaluated (130). The evaluation module (200) comprises: a second substrate (210) which is structured to be the same as the first substrate (110) and has an attachment location which corresponds to the attachment location on the first substrate (110); and at least one evaluation chip (230) which is structured to be the same as the multiple chips to be evaluated (130). The number of the evaluation chip (230) is at least one fewer than the number of the chips to be evaluated (130). The at least one evaluation chip (230) is arranged at at least one attachment location on the second substrate (210) such that the at least one evaluation chip (230) has the same heat dissipation performance and bear the same heat stress as the chip to be evaluated (130) arranged at a corresponding position on the multi-chip module (100). Also disclosed is a method for evaluating the life of the multi-chip module. The test cost can be significantly reduced, and the test process is simplified.
Inventors:
LIANG LIN (CN)
HAN LUBIN (CN)
KANG YONG (CN)
LIU XUDAN (CN)
HE MAOJUN (CN)
HAN LUBIN (CN)
KANG YONG (CN)
LIU XUDAN (CN)
HE MAOJUN (CN)
Application Number:
PCT/CN2020/118319
Publication Date:
March 31, 2022
Filing Date:
September 28, 2020
Export Citation:
Assignee:
BOSCH GMBH ROBERT (DE)
LIANG LIN (CN)
HAN LUBIN (CN)
KANG YONG (CN)
LIU XUDAN (CN)
HE MAOJUN (CN)
LIANG LIN (CN)
HAN LUBIN (CN)
KANG YONG (CN)
LIU XUDAN (CN)
HE MAOJUN (CN)
International Classes:
G01R31/26
Foreign References:
| CN106291309A | 2017-01-04 | |||
| CN107991597A | 2018-05-04 | |||
| CN105069258A | 2015-11-18 | |||
| US20140247857A1 | 2014-09-04 |
Attorney, Agent or Firm:
NTD PATENT AND TRADEMARK AGENCY LTD. (CN)
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