Title:
MULTI-COPPER CLUSTER AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/047987
Kind Code:
A1
Abstract:
The present application provides a multi-copper cluster having a molecular formula of [Cu8(X)6Y6]Z2, in which X is a ligand, Y is H- or D-, Z is a monovalent anion, and X includes a phosphorus atom and a plurality of polycyclic ring groups connected to the phosphorus atom. The present application further provides a preparation method for the multi-copper cluster, comprising the following steps: providing Cu(CH3CN)4Z and X; dissolving the Cu(CH3CN)4Z and X in a first solvent, and performing a reaction by means of stirring to obtain a first solution; and adding a compound containing negative valence hydrogen or deuterium to the first solution to obtain a third solution containing the multi-copper cluster.
Inventors:
WANG QUANMING (CN)
YUAN SHANGFU (CN)
YUAN SHANGFU (CN)
Application Number:
PCT/CN2018/113758
Publication Date:
March 12, 2020
Filing Date:
November 02, 2018
Export Citation:
Assignee:
UNIV TSINGHUA (CN)
International Classes:
C07F1/08
Foreign References:
| CN107652311A | 2018-02-02 | |||
| CN105503909A | 2016-04-20 | |||
| CN102516316A | 2012-06-27 |
Attorney, Agent or Firm:
ACIP LAW OFFICES (CN)
Download PDF:
Previous Patent: OLED DRIVING POWER SOURCE AND OLED TELEVISION
Next Patent: SIDE UNLOADING HOPPER CONTAINER FOR BREAK BULK CARGO
Next Patent: SIDE UNLOADING HOPPER CONTAINER FOR BREAK BULK CARGO