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Patent Searching and Data


Title:
MULTI-CORE LEAD WIRE INSERTION DEVICE AND MULTI-CORE LEAD WIRE INSERTION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/162956
Kind Code:
A1
Abstract:
Provided is a technique making it possible to insert a multi-core lead wire having several wires into a plurality of holes of a substrate in a stable state. A multi-core lead wire insertion device (100) according to one aspect of the present invention comprises a separation unit (3) that separates a plurality of wires of a multi-core lead wire having the plurality of wires by arranging the plurality of wires at positions separated from each other, a holding unit (4) that holds the plurality of wires separated by the separation unit (3) at predetermined arrangement positions, and an insertion unit (5) that inserts the plurality of wires held by the holding unit into respective holes of a plurality holes of a substrate.

Inventors:
TANAKA, Toshinori (JP)
TOOCHINDA, Siwakorn (JP)
YAMADA, Naohiro (JP)
Application Number:
PCT/JP2021/008588
Publication Date:
August 04, 2022
Filing Date:
March 05, 2021
Export Citation:
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Assignee:
OMRON CORPORATION (JP)
International Classes:
B21F15/00; B23P19/02; H05K13/06
Attorney, Agent or Firm:
MURAKAMI, Takashi (JP)
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