MULTI-LAYERED POLYIMIDE FILM AND METHOD FOR MANUFACTURING SAME

Title:

MULTI-LAYERED POLYIMIDE FILM AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2023/096340

Kind Code:

A1

Abstract:

The present invention provides a multi-layered polyimide film comprising at least one skin layer formed on at least one outer surface of a core layer, wherein the multi-layered polyimide film has a dielectric loss factor of 0.003 or less, an adhesive strength of 1,000 gf/cm or more, and a storage modulus of 1,000 MPa or more at 300℃, and a method for manufacturing same.

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Inventors:

CHAE SU-KYUNG (KR)
LEE KIL-NAM (KR)
BACK SUNG-YUL (KR)
CHO MIN-SANG (KR)

Application Number:

PCT/KR2022/018603

Publication Date:

June 01, 2023

Filing Date:

November 23, 2022

Export Citation:

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Assignee:

PI ADVANCED MAT CO LTD (KR)

International Classes:

B32B27/28; B32B15/08; B32B37/15; C08G73/10; C08J5/18; C08J7/04; C09D179/08

Foreign References:

KR20200120492A	2020-10-21
KR20130141628A	2013-12-26
KR20200052847A	2020-05-15
KR20200054101A	2020-05-19
JP2013100379A	2013-05-23

Attorney, Agent or Firm:

HANYANG PATENT FIRM (KR)

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