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Title:
MULTI-LINE CUTTING METHOD, MULTI-LINE CUTTING APPARATUS AND USE THEREOF, SEMICONDUCTOR MATERIAL AND POWER DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/151262
Kind Code:
A1
Abstract:
A multi-line cutting method, a multi-line cutting apparatus and use thereof, a semiconductor material and a power device. The multi-line cutting method comprises the following steps: configuring a line spool (20) for winding cutting lines (10) to vibrate under the excitation action of ultrasonic waves; and vibrating the cutting lines (10) to cut an object to be cut under the conveying action of the line spool (20). The vibration of the cutting line (10) under the excitation action of the ultrasonic waves can increase the energy of the cutting lines (10), enhance the cutting capability of the cutting lines (10), reduce the abrasion of the cutting lines (10), and force abrasive materials to impact and grind said object at high frequency and speed, and the chip removal speed is high, so that the surface curvature, the surface warpage, and the total thickness deviation of a product obtained after cutting are all small, and the cutting quality is high.

Inventors:
LAI BOFAN (CN)
ZHANG JIE (CN)
LIN WUQING (CN)
Application Number:
PCT/CN2019/111082
Publication Date:
July 30, 2020
Filing Date:
October 14, 2019
Export Citation:
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Assignee:
FUJIAN NORSTEL MATERIAL TECH CO LTD (CN)
International Classes:
B28D5/04
Foreign References:
CN109664424A2019-04-23
CN108177261A2018-06-19
CN1401467A2003-03-12
CN108357001A2018-08-03
CN103158204A2013-06-19
US6112737A2000-09-05
DE3716943A11988-12-08
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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