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Patent Searching and Data


Title:
MULTI-WIRE SLICER EMPLOYING DIAMOND WIRES
Document Type and Number:
WIPO Patent Application WO/2018/201263
Kind Code:
A1
Abstract:
A multi-wire slicer employing diamond wires, consisting of a wire mesh (2) for cutting, guide wheels, wire wheels (6), a cutting head, and a cooling system. Diamond wires (7) leading out from two ends of the wire mesh respectively pass over a first guide wheel (3) and a second guide wheel (4) and are connected to the two wire wheels. Upon passing over the first guide wheel, the direction of the diamond wire leading out from the wire mesh becomes perpendicular to the original leading-out direction thereof. After passing over the second guide wheel, the diamond wire is arranged in a direction parallel to the direction thereof before passing over the second guide wheel. The diamond wire passing over the second guide wheel is wound around the wire wheel. The two wire wheels rotate to drive the diamond wires and wire mesh to move, thereby performing a cutting operation. The wire mesh is wound around outer sides of two main rollers (1). The two wire wheels are arranged perpendicularly to the main rollers in the wire mesh. In the slicer, the wire wheels are rotated 90 degrees so as to be perpendicular to the main rollers, thus reducing tension loss of the system by 1/3. In addition, the direction of a wire arrangement error and the direction of tension adjustment are orthogonal and independent, thus realizing decoupling. In addition, the present invention enables highly efficient cooling by employing a oscillating cooling mechanism.

Inventors:
LV WEINAN (CN)
Application Number:
PCT/CN2017/000358
Publication Date:
November 08, 2018
Filing Date:
May 16, 2017
Export Citation:
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Assignee:
JIANGSU BINGCHEN TECH COMPANY (CN)
International Classes:
B28D5/04
Foreign References:
CN105599159A2016-05-25
CN201901484U2011-07-20
CN205951054U2017-02-15
CN203994282U2014-12-10
CN101628452A2010-01-20
CN103722627A2014-04-16
JP2006116636A2006-05-11
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