MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE

WIPO Patent Application WO/2022/018994

A1

The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable.　A first multilayer body of a first highly heat-resistant film and an inorganic substrate, said first multilayer body using substantially no adhesive and having the features (1) to (4) described below. (1) The tensile elastic modulus of the first highly heat-resistant film is 4 GPa or more. (2) The bonding strength between the first highly heat-resistant film and the inorganic substrate is 0.3 N/cm or less. (3) The surface roughness Ra of a surface of the first highly heat-resistant film, said surface being in contact with the inorganic substrate, is 5 nm or less. (4) The surface roughness Ra of the surface of the inorganic substrate after removal of the first highly heat-resistant film from the first multilayer body is 3 nm or less.

JP2619288	[Title of Invention] Method for manufacturing colored laminated glass
JPH06171055	COAT STRUCTURE

TOKUDA KAYA (JP)
OKUYAMA TETSUO (JP)
MAEDA SATOSHI (JP)
WATANABE NAOKI (JP)
YONEMUSHI HARUMI (JP)
MIZUGUCHI DENICHIROU (JP)

PCT/JP2021/021947

January 27, 2022

June 09, 2021

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TOYO BOSEKI (JP)

B32B17/10; B32B15/08; B32B18/00; B32B27/00; G09F9/00; G09F9/30

WO2020039928A1	2020-02-27
WO2012050072A1	2012-04-19

JP2016120663A	2016-07-07
JP2017124587A	2017-07-20
JP2013010342A	2013-01-17
JP2016083926A	2016-05-19
JP2007512568W
JP2012189974A	2012-10-04
JP2014086451A	2014-05-12
JP2014120664A	2014-06-30
JP2014100722A	2014-06-05

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