Title:
MULTILAYER SHRINKABLE POLYAMIDE FILM
Document Type and Number:
WIPO Patent Application WO/1998/047704
Kind Code:
A1
Abstract:
A heat-shrinkable, multilayer film possessing excellent pinhole resistance, transparency, and adhesion to a tray. Specifically, a heat-shrinkable, multilayer film comprising five layers of a polyamide layer, an EVOH layer, a polyamide layer, an adhesive resin layer, and a polyolefin layer, wherein the polyamide layer comprises 70 to 95 % by weight of nylon 6 and/or copolynylon 6-66 and 30 to 5 % by weight of noncrystalline nylon, the EVOH layer comprises a saponificate of an ethylene/vinyl acetate copolymer having an ethylene content of 20 to 65 % by mole, the polyolefin layer comprises a linear, low-density polyethylene (LLDPE) and/or a low-density polyethylene (LDPE), and the adhesive resin is a resin capable of bonding the polyamide layer to the polyolefin layer; and a process for preparing the same.
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Inventors:
KURIU HIROKI (JP)
BIWAKI HIDEKAZU (JP)
NIWA OSAMU (JP)
BIWAKI HIDEKAZU (JP)
NIWA OSAMU (JP)
Application Number:
PCT/JP1998/001796
Publication Date:
October 29, 1998
Filing Date:
April 20, 1998
Export Citation:
Assignee:
GUNZE KK (JP)
KURIU HIROKI (JP)
BIWAKI HIDEKAZU (JP)
NIWA OSAMU (JP)
KURIU HIROKI (JP)
BIWAKI HIDEKAZU (JP)
NIWA OSAMU (JP)
International Classes:
B32B7/02; B29C55/12; B32B27/08; B32B27/18; B32B27/28; B32B27/32; B32B27/34; (IPC1-7): B32B27/34; B32B27/28; B32B27/32
Foreign References:
| JPH04185322A | 1992-07-02 | |||
| JPH0459244A | 1992-02-26 | |||
| JPH05309775A | 1993-11-22 | |||
| JPS59152853A | 1984-08-31 | |||
| JPS59212261A | 1984-12-01 | |||
| JPH0655711A | 1994-03-01 |
Attorney, Agent or Firm:
Saegusa, Eiji (1-7-1 Dosho-machi, Chuo-k, Osaka-shi Osaka, JP)
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