Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MULTILAYER STRUCTURE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/066188
Kind Code:
A1
Abstract:
The present invention enables the achievement of a multilayer structure that is configured to be foldable, while being capable of suppressing breaking of a layer or member, which is vulnerable to flexing, due to folding of the multilayer structure. A multilayer structure which comprises: a first member; a first adhesive layer; a second member having one surface that is bonded to one surface of the first member, with at least the first adhesive layer being interposed therebetween; a second adhesive layer; and a first structure having one surface that is bonded to the other surface of the second member, with at least the second adhesive layer being interposed therebetween. This multilayer structure is used in applications where the multilayer structure is bent and deformed with the first member facing outward, and is characterized in that: the first structure has a third member on a surface that is in contact with the second adhesive layer; the multilayer structure has a configuration wherein tensile stresses respectively act on at least the outer surfaces of the first, second and third members when the multilayer structure is subjected to bending deformation; in the multilayer structure, the third member of the first structure has, on the surface that is in contact with the second adhesive layer, an easy-to-break layer which has a lower tensile elongation at break than the first and second members, and is thus easily broken at the time of the bending deformation; and the hardness of the first adhesive layer and the hardness of the second adhesive layer are determined such that the bending displacement occurred in the one surface of the first member, the bending displacement occurred in the one surface of the second member, the bending displacement occurred in the other surface of the second member, and the bending displacement occurred in the one surface of the third member interact with each other, respectively through the first adhesive layer and the second adhesive layer at the time of the bending deformation, thereby suppressing the elongation of the easy-to-break layer caused by the bending deformation to a value that is lower than the tensile elongation at break of the easy-to-break layer.

Inventors:
YANO TAKANOBU (JP)
TAKARADA SHOU (JP)
NAKANO TAKESHI (JP)
SHITARA KOJI (JP)
SUGITA YOSHITAKA (JP)
MINOURA KAZUTAKA (JP)
Application Number:
PCT/JP2020/037760
Publication Date:
April 08, 2021
Filing Date:
October 05, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B7/022; B32B7/023; B32B27/30; G02B1/14; G02B5/30; G06F3/041
Domestic Patent References:
WO2019026760A12019-02-07
WO2018037311A12018-03-01
Foreign References:
JP2019517974A2019-06-27
US20180287092A12018-10-04
US20180132370A12018-05-10
US20140205827A12014-07-24
US20150102298A12015-04-16
US20180294441A12018-10-11
KR20110106539A2011-09-29
JP2000151030A2000-05-30
Attorney, Agent or Firm:
TANAKA Shinichiro et al. (JP)
Download PDF: