Title:
MULTILAYER STRUCTURE AND METHOD FOR PRODUCING MULTILAYER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/039764
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a multilayer structure (1) that is capable of preventing or suppressing diffusion of a diffusion component from layers (12, 16), which contain the diffusion component, into layers (14, 17) that are adjacent to the layers (12, 16). A multilayer structure (1) which comprises: electroconductive layers (12, 16) that have electrical conductivity, while containing a diffusion component which is diffusible into adjacent layers (14, 17); and electroconductive diffusion prevention layers (14, 17) that are arranged to be adjacent to the electroconductive layers (12, 16), while containing at least one metal or metal oxide so as to have electrical conductivity, and also containing a rare gas so that the ratio of the number of atoms thereof to the number of atoms of the main metal in the at least one metal or metal oxide is 0.40 or more.
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Inventors:
IWATA HIROSHI (JP)
Application Number:
PCT/JP2020/031961
Publication Date:
March 04, 2021
Filing Date:
August 25, 2020
Export Citation:
Assignee:
KEIHIN RAMTECH CO LTD (JP)
International Classes:
B32B9/00; C23C14/08; C23C16/24; H01L31/0224; H01L31/0747; H01L51/44; H01L51/50; H05B33/28
Domestic Patent References:
| WO2012043124A1 | 2012-04-05 | |||
| WO2017195722A1 | 2017-11-16 | |||
| WO2013061637A1 | 2013-05-02 |
Foreign References:
| JP2017152695A | 2017-08-31 | |||
| JP2017028279A | 2017-02-02 | |||
| JPH0140884B2 | 1989-09-01 | |||
| JP2016106440A | 2016-06-16 | |||
| US20160329443A1 | 2016-11-10 |
Other References:
See also references of EP 4023431A4
Attorney, Agent or Firm:
TASS MEISTER PATENT FIRM (JP)
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