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Patent Searching and Data


Title:
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/206019
Kind Code:
A1
Abstract:
A multilayer substrate 1 comprises: a laminate 2 in which a plurality of insulation layers 10 are laminated in a lamination direction Z; a surface electrode 7 which is provided to the surface side of a first insulation layer 10a that, among the insulation layers, is positioned on the surface side of the laminate; a first internal electrode 24a which is provided on the reverse side of the surface electrode with the first insulation layer sandwiched therebetween; and a first interlayer connection conductor 14a which electrically connects the surface electrode and the first internal electrode. The first interlayer connection conductor has a front side connection surface 14x which is electrically connected to the surface electrode and a back side connection surface 14y which is electrically connected to the first internal electrode. The outer shape of the front side connection surface that does not extend beyond the outer shape of the back side connection surface. The surface electrode has a shape that covers the front side connection surface. The first internal electrode has a shape that covers the back side connection surface. The surface electrode comprises an electrode structure 3 which, when viewed from the lamination direction, is smaller than the first internal electrode and does not extend beyond the outer edge of the first internal electrode.

Inventors:
NISHIO KOSUKE (JP)
SODA KAZUYA (JP)
Application Number:
PCT/JP2021/014329
Publication Date:
October 14, 2021
Filing Date:
April 02, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46
Domestic Patent References:
WO2012124362A12012-09-20
Foreign References:
JP2010087429A2010-04-15
JP2004039732A2004-02-05
JP2018014387A2018-01-25
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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