MULTILAYER THERMAL RECOVERY ARTICLE, WIRE SPLICE, WIRE HARNESS, AND METHOD FOR MANUFACTURING ADHESIVE FOR MULTILAYER THERMAL RECOVERY ARTICLE

WIPO Patent Application WO/2015/151928

A1

The present invention addresses the problem of providing: a multilayer thermal recovery article, wherein the adhesive layer is able to ensure close adhesion to the adherend by flowing easily during heat-shrinking and does not flow out from the base layer after heat-shrinking; and a wire splice and a wire harness that are provided with a tube, which is such a multilayer thermal recovery article that has been heat-shrunk. In this multilayer thermal recovery article (1), which is provided with a cylindrical base layer (10) and an adhesive layer (11) that is laminated on the inner circumferential surface of said base layer (10): the adhesive layer (11) is formed from a resin composition that has polyamide as the main component and comprises essentially no inorganic filler; the resin composition is cross-linked by irradiation of ionizing radiation; and the shear viscosity of the adhesive layer (11) at 150°C is at least 300 Pa∙s at a shear rate of 0.01 s-1 and is not more than 200 Pa∙s at a shear rate of 100 s-1. These wire splice and wire harness are provided with a tube, which is said multilayer thermal recovery article (11) that has been heat-shrunk.

FUKUMOTO RYOTA (JP)
YAMASAKI SATOSHI (JP)
EMOTO YASUTAKA (JP)

PCT/JP2015/058894

October 08, 2015

March 24, 2015

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SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELEC FINE POLYMER INC (JP)

B32B1/08; B32B27/16; B32B27/34

WO2014054409A1

2014-04-10

JPH05247426A	1993-09-24
JPH06218873A	1994-08-09
JP2000500405A	2000-01-18

See also references of EP 3127692A4

NAKATA, Motomi et al. (JP)
Nakada Motoki (JP)

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