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Patent Searching and Data


Title:
MULTILAYER WIRING BOARD AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2006/118141
Kind Code:
A1
Abstract:
A multilayer wiring board employing a thin insulating substrate which is less compressed except resin flow and having a total layer IVH structure including at least one core layer formed without burying the wiring. In the multilayer wiring board, the rate of the thickness of a cover film to that of the electric insulating substrate is increased in order to ensure sufficient compression of collapse margin of a conductor efficiently so that a via can be formed in the core layer without burying the wiring for the insulating substrate. The multilayer wiring board of total layer IVH structure realizing high density component mountability and wiring containability with very thin film thickness can thereby be provided.

Inventors:
NAKAMURA TADASHI
ECHIGO FUMIO
HIRAI SHOGO
Application Number:
PCT/JP2006/308724
Publication Date:
November 09, 2006
Filing Date:
April 26, 2006
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
NAKAMURA TADASHI
ECHIGO FUMIO
HIRAI SHOGO
International Classes:
H05K3/46
Foreign References:
JP2002064270A2002-02-28
JPH11298105A1999-10-29
JPH0818238A1996-01-19
Attorney, Agent or Firm:
Iwahashi, Fumio c/o Matsushita Electric (Industrial Co. Ltd., 1006, Oaza Kadom, Kadoma-shi Osaka 01, JP)
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