Title:
MULTILAYERED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/005972
Kind Code:
A1
Abstract:
Provided is a multilayered substrate which comprises a transmission line having highly stable electrical properties against bending. The multilayered substrate comprises a transmission line in which a plurality of layers is layered, the plurality of layers including a first insulating layer, a first bonding material layer disposed in contact with a first surface of the first insulating layer, and a second bonding material layer disposed in contact with a second surface of the first insulating layer. The first insulating layer has a signal conductor of the transmission line formed on the first surface. The second bonding material layer has a dielectric constant that is less than the dielectric constant of the first bonding material layer. The adhesive strength between the first insulating layer and the first bonding material layer is greater than the adhesive strength between the first insulating layer and the second bonding material layer.
Inventors:
TENNO NOBUYUKI (JP)
IKEMOTO NOBUO (JP)
BABA TAKAHIRO (JP)
IKEMOTO NOBUO (JP)
BABA TAKAHIRO (JP)
Application Number:
PCT/JP2020/023357
Publication Date:
January 14, 2021
Filing Date:
June 15, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01P3/08; H05K3/46
Domestic Patent References:
| WO2016047540A1 | 2016-03-31 |
Foreign References:
| US20090211792A1 | 2009-08-27 | |||
| JP2001144452A | 2001-05-25 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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