Title:
MULTIPLYING IMAGE SENSOR
Document Type and Number:
WIPO Patent Application WO/2021/131372
Kind Code:
A1
Abstract:
This multiplying image sensor comprises a semiconductor layer having a first surface and a second surface, and a wiring layer provided on the second surface. The semiconductor layer includes a plurality of pixels disposed along the first surface. Each of the plurality of pixels includes: a first semiconductor region; a second semiconductor region formed on the second surface side with respect to at least a part of the first semiconductor region, and divided for each of the plurality of pixels; and a well region which is formed in the second semiconductor region so as to be separated from the first semiconductor region, and which constitutes a part of a pixel circuit. At least a part of the first semiconductor region and at least a part of the second semiconductor region form an avalanche multiplication region.
Inventors:
MASE MITSUHITO (JP)
HIRAMITSU JUN (JP)
ISHII HIROAKI (JP)
TANAKA YUMA (JP)
ITO TOSHINORI (JP)
HIRAMITSU JUN (JP)
ISHII HIROAKI (JP)
TANAKA YUMA (JP)
ITO TOSHINORI (JP)
Application Number:
PCT/JP2020/042061
Publication Date:
July 01, 2021
Filing Date:
November 11, 2020
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L31/107; H01L27/146; H04N5/369
Domestic Patent References:
| WO2017043068A1 | 2017-03-16 |
Foreign References:
| JP2019169643A | 2019-10-03 | |||
| JP2018157156A | 2018-10-04 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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