NEAR-INFRARED ABSORBING CURABLE COMPOSITION, CURED FILM, SOLID-STATE IMAGING ELEMENT, INFRARED ABSORBENT AND COMPOUND

WIPO Patent Application WO/2017/043175

A1

Provided is a near-infrared absorbing curable composition which is capable of forming a cured film that has excellent infrared light shielding properties and visible light transparency, while exhibiting excellent heat resistance and light resistance. Also provided are a cured film, a solid-state imaging element, an infrared absorbent and a compound. This near-infrared absorbing curable composition contains a compound represented by formula (1) and a compound having a crosslinkable group. In formula (1), each of X1 and X2 independently represents O, S or a dicyanomethylene group; and each of A and B independently represents a group represented by formula (2). In formula (2), the wavy line represents a bonding position at which the group is bonded to formula (1); YS represents a group having an active hydrogen; A1 represents an aromatic hydrocarbon ring or an aromatic heterocyclic ring; RZ represents a substituent; m1 represents an integer of 0-mA; mA represents the maximum integer up to which RZ can be substituted by A1; YS may combine with A1 or RZ so as to form a ring; and RZ may combine with A1 so as to form a ring.

HIRAI YUKI (JP)
SASAKI DAISUKE (JP)
JIMBO YOSHIHIRO (JP)

PCT/JP2016/070635

March 16, 2017

July 13, 2016

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FUJIFILM CORP (JP)

G02B5/22; C07C225/22; C07C233/43; C07C311/09; C07D209/04; C07D277/42; C07D519/00; C08F2/44; C08J3/24; C09K3/00

WO2012169447A1

2012-12-13

JP2013076926A	2013-04-25
JP2012077153A	2012-04-19
JP2015086378A	2015-05-07
JP2016027400A	2016-02-18

NAKASHIMA Junko et al. (JP)

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