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Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND POLYIMIDE PRECURSOR
Document Type and Number:
WIPO Patent Application WO/2018/003725
Kind Code:
A1
Abstract:
Provided is a negative photosensitive resin composition having excellent resolution. Also provided are a cured film using the negative photosensitive resin composition, a method for producing cured film, a semiconductor device, a method for producing a laminate, a method for producing a semiconductor device, and a polyimide precursor. The negative photosensitive composition contains a polyimide precursor, a photo polymerization initiator, and a solvent. The polyimide precursor has a repeating unit represented by formula (1), has a structure represented by "(A)l-L1-*" on at least one of the terminals, and a weight-average molecular weight not exceeding 50000. In formula (1), X represents a divalent organic group, Y represents a tetravalent organic group, and R1 and R2 each independently represent nonpolymerizable organic groups. In the abovementioned structure, A represents a polymerizable group, L1 represents a single bond or an l+1-valent organic group, l represents an integer from 1 to 10, and * represents a binding site with another site.

Inventors:
YOSHIDA KENTA (JP)
IWAI YU (JP)
SHIBUYA AKINORI (JP)
Application Number:
PCT/JP2017/023341
Publication Date:
January 04, 2018
Filing Date:
June 26, 2017
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/027; C08F290/06; C08F299/02; G03F7/004; G03F7/029; G03F7/031; G03F7/20; G03F7/40
Domestic Patent References:
WO2015199219A12015-12-30
WO2012165448A12012-12-06
Foreign References:
JP2003167337A2003-06-13
JP2004124054A2004-04-22
JP2000281671A2000-10-10
Attorney, Agent or Firm:
SIKS & CO. (JP)
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