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Title:
NON-PERFLUORO FLUORORESIN MOLDED ARTICLE HAVING LOW-TEMPERATURE HEAT SEALABILITY
Document Type and Number:
WIPO Patent Application WO/2000/020489
Kind Code:
A1
Abstract:
A non-perfluoro fluororesin molded article having a low-temperature heat-sealable surface layer in at least a part of the surface layer thereof, characterized in that the low-temperature heat-sealable surface layer portion has a ratio of the number of fluorine atoms to that of carbon atoms (F/C) of 0.2 to 0.9 and a ratio of the number of oxygen atoms to that of carbon atoms (O/C) of 0.09 to 0.40, and the residual part of the surface layer has a ratio of the number of fluorine atoms to that of carbon atoms (F/C) which is greater than that of low-temperature heat-sealable portion and is 0.8 to 1.8. The present invention can be used for imparting excellent low-temperature heat-sealing properties to a non-perfluoro fluororesin molded article having an F/C of 1.8 or less and for providing a non-perfluoro fluororesin molded article being suitable, in particular, for a cover film for a solar battery.

Inventors:
ICHIBA SHIGERU (JP)
NAKATA YUTAKA (JP)
SHIMADA KAZUHIKO (JP)
Application Number:
PCT/JP1999/005433
Publication Date:
April 13, 2000
Filing Date:
October 01, 1999
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
ICHIBA SHIGERU (JP)
NAKATA YUTAKA (JP)
SHIMADA KAZUHIKO (JP)
International Classes:
B32B27/08; C08J7/12; H01M50/121; H01M50/129; H01M50/131; (IPC1-7): C08J5/00; B32B7/10
Foreign References:
JPS5973942A1984-04-26
EP0631328A11994-12-28
JPH06196742A1994-07-15
Other References:
See also references of EP 1160270A4
Attorney, Agent or Firm:
Asahina, Sohta (Tanimachi 2-chome Chuo-ku Osaka-shi Osaka, JP)
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