NOVEL COPOLYMER AND PHOTORESIST COMPOSITIONS THEREOF

Title:

NOVEL COPOLYMER AND PHOTORESIST COMPOSITIONS THEREOF

Document Type and Number:

WIPO Patent Application WO2004040371

Kind Code:

A3

Abstract:

Novel copolymers suitable for forming the top layer photoimageable coating in a deep UV, particularly a 193 nm and 248 nm, bilayer resist system providing high resolution photolithography. Chemically amplified photoresist composition an organosilicon moieties suitable for use in the binder resin for photoimageable etching resistant photoresist composition that is suitable as a material for use in ArF AND Krf photolithography using the novel copolymers.

Inventors:

DE BINOD B
MALIK SANJAY
DILOCKER STEPHANIE J
DIMOV OGNIAN N

Application Number:

PCT/US2003/034832

Publication Date:

July 15, 2004

Filing Date:

October 31, 2003

Export Citation:

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Assignee:

ARCH SPEC CHEM INC (US)

International Classes:

B32B9/04; C08F34/00; C08F130/08; C08F220/30; C08F230/08; C08G77/20; G03C1/492; G03C1/73; G03C5/08; G03F7/039; G03F7/075; G03F7/20; G03F7/30; G03F7/36; G03F; (IPC1-7): C08F34/00; C08F130/08; C08G77/20; G03C1/492; G03C5/08

Foreign References:

US20020128414A1	2002-09-12
US20020182541A1	2002-12-05
US6664024B1	2003-12-16
US20040068075A1	2004-04-08

Other References: