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Patent Searching and Data


Title:
NOVEL INTEGRATION SCHEME WITH CPU BONDING TO 3D XPOINT CHIP
Document Type and Number:
WIPO Patent Application WO/2022/077147
Kind Code:
A1
Abstract:
A 3D crosspoint memory is bonded to a central processing unit chip. Faster data processing and transferring with higher efficiency is achieved by introduction of 3D crosspoint into both VM and NVM systems. There is direct bonding of the CPU to 3D crosspoint chip and host system bonding to SSD. Electrical routing distance is shortened compared to conventional systems. Having the 3D crosspoint memory included in the main memory and the CPU bonded to the non-volatile memory chip provides better CPU performance due to shorter distance between CPU and main memory. In addition, manufacturing cost is less and higher data storage capability is available compared to conventional DRAM. Higher signal-to-noise ratio, less PCB area consumption die size, lower bit cost, denser arrangements of functional modules like CPU, memories, engines, and the like, and faster processing speed is provided compared to conventional systems.

Inventors:
CHENG WEIHUA (CN)
LIU JUN (CN)
Application Number:
PCT/CN2020/120321
Publication Date:
April 21, 2022
Filing Date:
October 12, 2020
Export Citation:
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Assignee:
YANGTZE ADVANCED MEMORY IND INNOVATION CENTER CO LTD (CN)
International Classes:
G11C7/12; G11C7/10
Foreign References:
US20140175371A12014-06-26
CN110914907A2020-03-24
US9837471B22017-12-05
Attorney, Agent or Firm:
NTD UNIVATION INTELLECTUAL PROPERTY AGENCY LTD. (CN)
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