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Title:
NUCLEIC ACID MICROARRAY, PROCESS FOR PRODUCTION OF THE SAME, AND SUBSTRATE FOR NUCLEIC ACID MICROARRAY
Document Type and Number:
WIPO Patent Application WO/2006/104260
Kind Code:
A1
Abstract:
Disclosed are a nucleic acid microarray which can immobilize a nucleic acid thereon satisfactorily without the need of the immobilization through a covalent bond provided by introducing a specific reactive group to a substrate or the nucleic acid; a substrate for the nucleic acid microarray; and others. A nucleic acid microarray comprising a plastic substrate and a nucleic acid immobilized on the substrate, at least the surface of the substrate containing an inorganic filler selected from the group consisting of an oxide filler, a hydroxide filler, a carbonate filler and a sulfate filler; a nucleic acid microarray comprising a plastic substrate which has been treated with plasma or an ion beam and a nucleic acid immobilized on the substrate, the at least the surface of the substrate containing an inorganic filler selected from the group consisting of an oxide filler, a hydroxide filler, a carbonate filler and a sulfate filler; a process for producing the nucleic acid microarray; a substrate for the nucleic acid microarray; and a method for detecting a nucleic acid using the nucleic acid microarray.

Inventors:
UMEHARA NORITSUGU (JP)
AKAGAMI YOICHI (JP)
KATO MASARU (JP)
IMAI JUN (JP)
YOSHIDA HIROSHI (JP)
KUSABA NOBUTAKA (JP)
Application Number:
PCT/JP2006/307284
Publication Date:
October 05, 2006
Filing Date:
March 30, 2006
Export Citation:
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Assignee:
UNIV NAGOYA NAT UNIV CORP (JP)
AKITA PREFECTURE (JP)
INC NAT UNIVERSITY IWATE UNIVE (JP)
NIPRO CORP (JP)
UMEHARA NORITSUGU (JP)
AKAGAMI YOICHI (JP)
KATO MASARU (JP)
IMAI JUN (JP)
YOSHIDA HIROSHI (JP)
KUSABA NOBUTAKA (JP)
International Classes:
G01N33/53; G01N33/543; G01N33/545; G01N33/58; G01N37/00
Foreign References:
JP2003279574A2003-10-02
JP2004108859A2004-04-08
JP2005030913A2005-02-03
Attorney, Agent or Firm:
Takashima, Hajime (1-1 Fushimimachi 4-chome, Chuo-k, Osaka-shi Osaka, JP)
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