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Patent Searching and Data


Title:
OLED ENCAPSULATION MATERIAL, MANUFACTURING METHOD THEREOF, AND OLED ENCAPSULATION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/039797
Kind Code:
A1
Abstract:
The present invention relates to an OLED encapsulant provided in a form of a film to be laminated on an OLED array substrate, a manufacturing method thereof, and an OLED encapsulation method using the same. The present invention can utilize the existing encapsulation process equipment as it is, and greatly expand the breadth of choice with respect to base materials having heat dissipation characteristics to various materials such as aluminum, copper, or graphite, which have excellent heat dissipation characteristics but have hardly been used in the prior art, can improve the heat dissipation characteristics of OLED dramatically, and can be advantageously applied particularly to a encapsulation process of the latest large-area display having high brightness and high pixel area, by selecting various materials having excellent heat dissipation characteristics as a sheet-like base material, and introducing a separate magnetic carrier member, which is provided temporarily adhered to the bottom surface of the base material and is peeled off after completion of the encapsulation process, to be integrated as a portion of the OLED encapsulating material.

Inventors:
CHANG YON (KR)
Application Number:
PCT/KR2018/009455
Publication Date:
February 28, 2019
Filing Date:
August 17, 2018
Export Citation:
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Assignee:
CHANG YON (KR)
International Classes:
H01L51/52; B32B7/12; B32B9/04; B32B15/08; H01L51/56
Foreign References:
KR20140058018A2014-05-14
KR20130022441A2013-03-07
KR101543888B12015-08-11
KR20160101693A2016-08-25
KR20170051600A2017-05-12
Attorney, Agent or Firm:
MI PATENT AND LAW FIRM (KR)
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