Title:
ONIUM SALT-CONTAINING PROCESSING SOLUTION FOR SEMICONDUCTOR WAFERS
Document Type and Number:
WIPO Patent Application WO/2020/166677
Kind Code:
A1
Abstract:
Provided is, inter alia, a processing solution for semiconductor wafers for use in a semiconductor formation process. Provided is, inter alia, a processing solution that contains (A) hypochlorite ions and (B) an alkylammonium salt represented by formula (1). (In the formula, a is an integer from 6 to 20 and R1, R2, and R3 are independently a C1-20 alkyl group or the like. X- is a chloride ion or the like.)
Inventors:
KIKKAWA YUKI (JP)
SATO TOMOAKI (JP)
SHIMODA TAKAFUMI (JP)
NEGISHI TAKAYUKI (JP)
SATO TOMOAKI (JP)
SHIMODA TAKAFUMI (JP)
NEGISHI TAKAYUKI (JP)
Application Number:
PCT/JP2020/005663
Publication Date:
August 20, 2020
Filing Date:
February 13, 2020
Export Citation:
Assignee:
TOKUYAMA CORP (JP)
International Classes:
H01L21/306; C07C211/63; C07C381/12; C07F9/54; C09K13/04; C09K13/06; C23F1/40; H01L21/308; H01L21/3213; H01L21/768
Domestic Patent References:
| WO2011074601A1 | 2011-06-23 | |||
| WO2016167184A1 | 2016-10-20 | |||
| WO2016140246A1 | 2016-09-09 | |||
| WO2016068183A1 | 2016-05-06 | |||
| WO2011074601A1 | 2011-06-23 |
Foreign References:
| JP2016510175A | 2016-04-04 | |||
| JP2008536312A | 2008-09-04 | |||
| US20090124082A1 | 2009-05-14 | |||
| US20180291309A1 | 2018-10-11 | |||
| JP2008135746A | 2008-06-12 | |||
| JP2002161381A | 2002-06-04 | |||
| JP2001234373A | 2001-08-31 | |||
| JPS5314019B2 | 1978-05-15 |
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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