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Patent Searching and Data


Title:
OPTICAL FINGERPRINT SENSOR AND PACKAGING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/187963
Kind Code:
A1
Abstract:
An optical fingerprint sensor and a packaging method therefor. The optical fingerprint sensor comprises: a packaging substrate (107), a sensor chip (104), an optical cover plate (101), and a connecting unit (106). The optical cover plate (101) is light-transmissive. The lower surface of the sensor chip (104) is adhered to the upper surface of the packaging substrate (107) by means of a first adhesive layer (105). The lower surface of the optical cover plate (101) is adhered to the upper surface of the sensor chip (104) by means of a second adhesive layer (102). The sensor chip (104) is connected to the packaging substrate (107) by means of the connecting unit (106). The sides of the packaging substrate (107), the first adhesive layer (105), the sensor chip (104), the second adhesive layer (102), and the optical cover plate are plastic-encapsulated by a plastic encapsulation adhesive body (103). The second adhesive layer (102) is light-transmissive. The optical fingerprint sensor and the packaging method therefor can reduce the volume of the optical fingerprint sensor, so that the optical fingerprint sensor can be better hidden in an electronic device.

Inventors:
LONG WEI (CN)
WU BAOQUAN (CN)
Application Number:
PCT/CN2017/080229
Publication Date:
October 18, 2018
Filing Date:
April 12, 2017
Export Citation:
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Assignee:
SHENZHEN GOODIX TECH CO LTD (CN)
International Classes:
H01L21/50; G06K9/00; H01L23/10
Foreign References:
CN104850840A2015-08-19
CN105529308A2016-04-27
CN105304575A2016-02-03
CN205003690U2016-01-27
CN106098644A2016-11-09
CN104779223A2015-07-15
TW200816420A2008-04-01
Other References:
See also references of EP 3428837A4
Attorney, Agent or Firm:
LONGSUN LEAD IP LTD. (CN)
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